型号:

BBL-118-T-F

RoHS:无铅 / 符合
制造商:Samtec Inc描述:CONN HEADR LOPRO 18POS .100 TIN
详细参数
数值
产品分类 连接器,互连式 >> 板至板 - 接头,公引脚
BBL-118-T-F PDF
产品培训模块 Board-to-Board Connectors
产品目录绘图 BBL-xxx-G-F Series
特色产品 Board-To-Board Interconnect Systems
标准包装 1
系列 BBL
连接器类型 无罩
位置数 18
加载位置的数目 全部
间距 0.100"(2.54mm)
行数 1
行间距 -
高度堆叠(配接) -
超出电路板的模制高度 0.085"(2.16mm)
触点接合长度 0.122"(3.10mm)
安装类型 通孔
端子 焊接
触点表面涂层
触点涂层厚度 -
特点 -
颜色
包装 散装
配套产品 SAM1110-18-ND - CONN RCPT .100" 18POS TIN PCB
SAM1109-18-ND - CONN RCPT .100" 18POS TIN PCB
SAM1108-18-ND - CONN RCPT .100" 18POS TIN PCB
SAM1107-18-ND - CONN RCPT .100" 18POS GOLD PCB
SAM1106-18-ND - CONN RCPT .100" 18POS GOLD PCB
SAM1105-18-ND - CONN RCPT .100" 18POS GOLD PCB
SAM1104-18-ND - CONN RCPT .100" 18POS GOLD PCB
SAM1103-18-ND - CONN RCPT .100" 18POS GOLD PCB
SAM1102-18-ND - CONN RCPT .100" 18POS GOLD PCB
其它名称 SAM1003-18
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